169, Harrison avenue Boston, MA 02111.
+1 857-302-4704

TECHNOLOGICAL ADVANCEMENT RESOLVING CRITICAL CHALLENGES IN THE GLOBAL SEMICONDUCTOR PACKAGING MATERIAL MARKET

TECHNOLOGICAL ADVANCEMENT RESOLVING CRITICAL CHALLENGES IN THE GLOBAL SEMICONDUCTOR PACKAGING MATERIAL MARKETFrom the evolution of the semiconductor package, the technology in the semiconductor packaging material has been progressing drastically, and varied types of semiconductor packages have been introduced in the market. The three engineers from Fairchild Don Forbes, Rex Rice, and Bryant Rogers invented the first semiconductor package; a 14-lead ceramic DIP (Dual-in-Line Package) with two rows of pins. However, its production gained momentum in early 70’s.

The semiconductor packages consist of plastic, metal, and ceramic components that not only prevents the fabricated IC on the semiconductor die; is also the interconnection amid the PCB (printed circuit board) and the die. Moreover, it prevents the die from external automated collision and corrosion and is also the electrically conductive interconnection with superior signal procreation properties.

The dramatic development of the electronics industry over the last half-century is majorly due to the semiconductor market. With the evolving requirement of smartphones and computers, tablets, further high speed, low power consumption LSI thinner and smaller semiconductor packaging is the need of the day. Currently, 3D semiconductor packaging segment is highly in demand and growing rigorously.

The technology in semiconductor packaging material is constantly striving to assimilate extra power in less space. These technologies are aiding to resolve essential hurdles like packaging size, cost benefits, and temperature. The top technologies mentioned in the market are Dual-in-Line Package (Dip), Flat No-Leads Packages, Small Outline (So) Packages, Quad Flat Packages (Qfp), and Grid Array (Ga) Packages. The other technology includes other isolated packaging technologies that are used in combination of two or more of the packaging technologies mentioned above.

The major types of materials used in the q are bonding wires, organic substrates, ceramic packages, lead frames, die to attach materials, encapsulation resins, solder balls, and other semiconductor packaging materials. All of these materials can be categorized into two major umbrella categories, lead frame-type packages, and subtract-based packages. The physical and electrochemical features of the material are focused on the functioning of the package. The lead frame packages encompass lead frame and bonding wires and are very economical. A wide range of packages is available in the market which is utilized in varied applications like consumer electronics, telecommunication sector, and also in automotive controls like converters, pump controls, EV, powertrains, etc.

Accompanying the advancement in the semiconductors a wide range of packaging technologies are being utilized focusing on the reduction of system size, enhancement in system’s density, and cost benefits. This assured the application of different packaging materials in the exclusive form of innovative packaging. However, the effect on the authenticity of the semiconductor with the complexity of the technology, the functioning of this packaging material tends to develop.

The global semiconductor packaging materials market is profoundly disintegrated. The majority of the market is concentrated in the Asia Pacific region. The regional players are competing by offering exclusive solutions at a reasonable price which is leading a price war with bigger players. To retain the dominance in the market, the global players have adopted the strategy of acquiring regional or local players. The seven major players in the global semiconductor packaging materials market DuPont, Hitachi Chemical, Honeywell, Henkel, Toppan Printing, and KYOCERA.

Komal Surana

Author: Komal Surana

Sr. Content Writer and Editor, Inkwood Research

Like
Like Love Haha Wow Sad Angry

Related Posts

Leave a comment